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个人信息Personal Information
教师英文名称：Xiaokui
职称：研究员（自然科学）
博士生导师
毕业院校：北京科技大学
学科：材料学
学历：研究生
学位：博士
所在单位：新材料技术研究院
- 邹士文，肖葵*，董超芳，李慧艳，李晓刚, 霉菌环境下喷锡处理印制电路板的腐蚀行为, 中国有色金属学报, 2013, (03)：809~815..
- 丁康康，肖葵*，邹士文，李昊然，李晓刚, 稀H2SO4液滴对PCB初期腐蚀行为的影响, 有色金属学报, 2014, 24(10)：2565~2575..
- 丁康康，李晓刚，董超芳，易 盼，刘 明，肖葵*, 无电镀镍浸金处理电路板在 NaHSO3溶液中的腐蚀电化学行为与失效机制, 工程科学学报, 2015, 37(6)：731~738..
- 易盼，丁康康，宋维锋，董超芳，李晓刚，吴俊升，肖葵*，盐雾对喷锡和化金印制电路板腐蚀行为的影响，工程科学学报，2015, 37(12): 1601-1609..
- 吴伟，郝文魁，李晓刚，钟平，董超芳，刘智勇，肖葵*, 高Cl-环境对M152和17-4PH高强钢应力腐蚀开裂行为的影响, 材料工程, 2018, 46(2): 105-114..
- 丁康康，肖葵*，邹士文，董超芳，赵瑞涛，李晓刚, PCB-HASL电路板在NaHSO3/Na2SO3溶液中的腐蚀电化学行为, 金属学报, 2014, 50(10)：1269~1278. （IF=""1.545）.
- Wang Jirui, Bai Ziheng, Xiao Kui* , et al.Effect of static magnetic fifield on mold corrosion of printed circuit boards,Bioelectrochemistry, 2020,131: 107394-17403..
- Xiao Kui, Xue Wei, Li Zhaioliang, et al. Effect of sintering temperature on the microstructure and performance of a ceramic coating obtained by the slurry method, Ceramics International, 2018, 44(10):11180-11186..
- Zou Shiwen, Li Xiaogang, Dong Chaofang, Ding Kangkang, Xiao Kui*. Electrochemical migration, whisker formation, and corrosion behavior of printed circuit board under wet H2S environment. Electrochimica Acta, 2013, 114(12): 363-371.
- Yan Lidan, Xiao Kui*，Yi Pan，et al. Surface analysis of silver-plated circuit boards in a salt-spray environment. JOURNAL OF ALLOYS AND COMPOUNDS, 2016, 688(12) :301-312..
- Yan Lidan, Xiao Kui*，Yi Pan，et al. The corrosion behavior of PCB-ImAg in industry polluted marine atmosphere environment, MATERIALS & DESIGN, 2017, 115(2): 404-414.
- Yi Pan, Dong Chaofang, Xiao Kui*, et al. Surface failure analysis of a field-exposed copper-clad plate in a marine environment with industrial pollution, APPLIED SURFACE SCIENCE, 2017, 339(3):608-616.
- Yi Pan, Xiao Kui*, Dong Chaofang, et al. Effects of mould on electrochemical migration behaviour of immersion silver finished printed circuit board, BIOELECTROCHEMISTRY, 2018, 119(3):203-210.
- Wei Xue, Zhaoliang Li, Kui Xiao⁎，et al.Initial microzonal corrosion mechanism of inclusions associated with the precipitated (Ti, Nb)N phase of Sb-containing weathering steel，Corrosion Science，2020，163：108232-108241..
- Xiao Kui，Yi Pan, Dong Chaofang，et al. Role of mold in electrochemical migration of copper-clad laminate and electroless nickel/immersion gold printed circuit boards, MATERIALS LETTERS, 2018, 210(5):283-286..