·Patents
一种可拉伸柔性电子器件的制备方法及产品
Release time:2018-03-27 Hits:
Affilication of Author(s): 华中科技大学
School Sign: 华中科技大学
Patent Applicant: 吴志刚,张硕,彭鹏
Disigner of the Invention: 华中科技大学
Type of Patent: Invent
Application Number: 201610205824.1
Authorization number: CN 105810598 B
Number of Inventors: 3
Application Date: 2016-04-05
Authorization Date: 2017-03-22
CN201610205824-一种可拉伸柔性电子器件的制备方法及产品-审定授权.pdf