[内容简介]

　　《集成电路封装材料的表征(英文)》的主要内容包括： Foreword；Preface to the Reissue of the Materials Characterization Series xiii；Preface to Series xiv；Preface to the Reissue of Integrated Circuit Packaging Materials xv；Preface xvi；Contributors xix等。

[目录]

Foreword xi 
Preface to the Reissue of the Materials Characterization Series xiii 
Preface to Series xiv 
Preface to the Reissue of Integrated Circuit Packaging Materials xv 
Preface xvi 
Contributors xix 
IC PACKAGE RELIABILITY TESTING 
MOLD COMPOUND ADHESION AND STRENGTH 
MECHANICAL STRESS IN IC PACKAGES 
MOISTURE SENSITMTY AND DELAMINATION 
THERMAL MANAGEMENT 
ELECTRICAL PERFORMANCE OF IC PACKAGES 
SOLDERABILITY OF INTEGRATED CIRCUITS 
HERMETICITY AND JOINING IN CERAMIC IC PACKAGES 
ADVANCED INTERCONNECT TECHNOLOGY 
APPENDIX： TECHNIQUE SUMMARIES