Microstructural evolution and thermal conductivity of diamond/Al composites during thermal cycling
Ping-ping Wang, Guo-qin Chen, Wen-jun Li, Hui Li, Bo-yu Ju, Murid Hussain, Wen-shu Yang, and Gao-hui Wu
2021, 28(11): 1745-1758.
DOI: 10.1007/s12613-020-2087-z
2021, 28(11): 1769-1776.
DOI: 10.1007/s12613-020-2172-3
2021, 28(11): 1777-1787.
DOI: 10.1007/s12613-020-2100-6
2021, 28(11): 1788-1798.
DOI: 10.1007/s12613-020-2089-x
2021, 28(11): 1799-1810.
DOI: 10.1007/s12613-020-2163-4
2021, 28(11): 1811-1820.
DOI: 10.1007/s12613-020-2128-7
2021, 28(11): 1821-1827.
DOI: 10.1007/s12613-020-2114-0
2021, 28(11): 1828-1835.
DOI: 10.1007/s12613-020-2207-9
2021, 28(11): 1836-1843.
DOI: 10.1007/s12613-020-2064-6
2021, 28(11): 1844-1853.
DOI: 10.1007/s12613-020-2212-z
2021, 28(11): 1854-1860.
DOI: 10.1007/s12613-021-2324-0
2021, 28(11): 1861-1867.
DOI: 10.1007/s12613-020-2110-4
2021, 28(11): 1868-1874.
DOI: 10.1007/s12613-020-2197-7