报告题目：Flexible and Printed Electronics for Interactive Systems

报告人：Ravinder Dahiya教授

报告人单位：美国东北大学

报告时间：2024年10月14日（星期一）10:00

会议地点：科技D楼1903会议室

举办单位：柔性电子（未来技术）学院、先进材料研究院

报告人简介：Ravinder Dahiya is Professor in the Department Electrical and Computer Engineering at Northeastern University, Boston, USA. His group (Bendable Electronics and Sustainable Technologies (BEST)) conducts research in flexible printed electronics, electronic skin, and their applications in robotics, wearables, and interactive systems. He has authored or co-authored more than 500 publications, books and submitted/granted patents and disclosures. He has led or contributed to many international projects. Prof. Dahiya is serving on Board of Directors of IEEE as Division X Director-Elect and is the Past President of IEEE Sensors Council. He is the Editor-in-Chief (EiC) ofnpj Flexible Electronics. He is also the founder of the IEEE Journal on Flexible Electronics and served as its Founding EiC. He has been on the editorial boards of several other journals. He also founded the IEEE International Conference on Flexible, Printed Sensors and Systems (FLEPS) and served as the General Chair or Technical Programme Chair of several international conferences. He is recipient of EPSRC Fellowship, Marie Curie Fellowship and Japanese Monbusho Fellowship and has received several awards, including Technical Achievement award from IEEE Sensors Council, Young Investigator Award from Elsevier, and 13 best journal/conference paper awards as author/co-author. He is Fellow of IEEE and the Royal Society of Edinburgh. Group Website:https://best.sites.northeastern.edu

报告摘要：The micro/nanoelectronics have served greatly the society through miniaturization led fast computing and communication. However, miniaturization alone is insufficient as many of the emerging applications (e.g., interactive systems, wearables, flexible displays etc.) require electronics with features such as flexible form factors, easy integration on soft materials and sustainable manufacturing etc. Such requirements call for innovative and resource-efficient methods to fabricate high-performance electronic devices and circuits on unconventional flexible and stretchable substrates. This talk will present recent advances in these directions, focusing on approaches such as hybrid integration of the off-the-shelf devices on soft substrates, system in foil using ultra-thin chips, and direct roll printing (DRP) and contact roll printing (CRP) of high-mobility semiconducting nanostructures for resource efficient fabrication of flexible electronics. These methods are expected to transform the way electronic circuits will be manufactured in future while continuing to serve the requirements of applications such as robotics, wearables, healthcare and many more.

审核：安众福