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一种基于无芯光纤径向大错位结构涂覆聚二甲基硅氧烷的点式温度传感装置

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Patent Applicant:张勇(S),huhaifeng,雷铭(S),杨时月(S)

Note:专利证书编号:CN 108279079 A

Service Invention or Not:no

Application Date:2018-01-08

Publication Date:2018-07-13

First Author:Zhao Yong

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一种基于无芯光纤径向大错位结构涂覆聚二甲基硅氧烷的点式温度传感装置
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一种基于光纤错位熔接结构和Sagnac环的温度和折射率双参数传感装置
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