Dr. Dong F. Wang received the B.E. and M.E. degrees in materials science and engineering from Zhejiang University, China, and the Ph.D. degree in mechatronic engineering from Tohoku University, Japan.
He was with Prof. Masayoshi Esashi at MEMS Laboratory of Tohoku University, where his research was focused on the micro/nano tribology of ultrathin diamond-like films, nano-mechanics of ultrathin silicon resonators, and micro/nano magnetic mesa structures for all-silicon quantum computers. Since 2014, he has been a Leading Professor with the Micro Engineering and Micro Systems Laboratory (JML), Jilin University, China, where he is mainly involved in non-linear vibration and its sensing applications to IoT (Internet of Things), such as new sensing mechanisms/schemes, new mechanical sensors/devices/systems, new energy harvesters/power suppliers, as well as new sensing materials/smart manufacturing.
He coauthored 2 international book chapters in Micro Electro Mechanical Systems (Springer, 2018), published 200+ peer-reviewed articles in international journals and conference proceedings, holds 50+ Chinese patents and 2 Japanese patents, and delivered many invited talks on micro engineering and micro systems.
He received several awards from Japan, USA, and China, and serves as General Chair, Vice Chairperson, TPC Member etc. for 10+ international conferences, and as contributing reviewer for 40+ SCI indexed journals. He is one of the founders of the Annual IEEE NEMS International Conference on Nano/Micro Engineered and Molecular Systems since 2006, and the Japan-China-Korea Joint Conference on MEMS/NEMS since 2006.
His group is also collaborating with researchers from The University of Tokyo, as well as National Institute of Advanced Industrial Science and Technology in Ubiquitous MEMS and Micro Engineering.
He is a Senior Member of Chinese Mechanical Engineering Society (CMES), as well as Chinese Society of Micro-Nano Technology (CSMNT). He is also a Member of Institute of Electrical and Electronics Engineers (IEEE), Japanese Society of Mechanical Engineers (JSME), Institute of Electrical Engineers of Japan (IEEJ), Japan Society of Next Generation Sensor Technology, as well as MEMS Industry Forum.