一种废弃电路板的焊锡回收、自动拆解装置
Release time:2023-02-25
Hits:
- Type of Patent:
- 发明专利
- Authorization number:
- CN 112620854 B
- Authorization Date:
- 4463-08-01
- First Author:
- 于洁
- Pre One:一种基于热载体双循环供热的废塑料处置系统及方法
- Next One:一种电路板焊锡脱落装置