魏青松

·Patents

Current position: 英文主页 > Scientific Research > Patents
一种基于增材制造与热等静压的零件成形方法及系统
Release time:2023-05-26  Hits:

Disigner of the Invention: 史玉升,苏瑾,魏青松,刘洁,蔡超,滕庆

Type of Patent: Invent

Application Date: 2020-08-04

Authorization Date: 2022-07-19

First Author: 薛鹏举