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Rong Chen

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Patents

一种可拉伸电子器件的薄膜封装组件及其制备方法

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Affilication of Author(s):华中科技大学

School Sign:华中科技大学

Disigner of the Invention:李云,单斌,曹坤,张英豪,林源,杨惠之

Type of Patent:Invent

Authorization number:ZL201911003784.2

Number of Inventors:5

Authorization Date:2019-10-22

First Author:陈蓉

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