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High frequency conducted EMI investigation on packaging and modulation for a Sic-based high frequency converter. Xie, Y.; Chen, C. ; Huang, Z.; Liu, T.; Kang, Y.; Luo, F. IEEE Journal of Emerging and Selected Topics in Power Electronics, 2019
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上一条：Design and evaluation of laminated busbar for three-level T-type NPC power electronics building block with enhanced dynamic current sharing. Yuan, Z., Peng, H., Deshpande, A., Narayanasamy, B., Emon, A. I., Luo, F.,Chen, C. IEEE Journal of Emerging and Selected Topics in Power Electronics, 2019
下一条：A High-Performance Embedded SiC Power Module Based on a DBC-Stacked Hybrid Packaging Structure. Huang, Z.; Chen, C.; Xie, Y.; Yan, Y.; Kang, Y.; Luo, F. IEEE Journal of Emerging and Selected Topics in Power Electronics, 2019