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论文类型：期刊论文

第一作者：刘丹丹

通讯作者：伍文杰,涂良成

合写作者：刘骅锋,刘金全,胡方靖,范继

发表刊物：Sensors

收录刊物：SCI、SSCI

学科门类：工学

一级学科：电子科学与技术

文献类型：J

卷号：20

关键字：MEMS accelerometer; capacitive transducer; temperature gradient; bonding warpage

DOI码：10.3390/s20041186

发表时间：2020-02-19

摘要：Capacitive MEMS accelerometers with area‐variable periodic‐electrode displacement transducers found wide applications in disaster monitoring, resource exploration and inertial navigation. The bonding‐induced warpage, due to the difference in the coefficients of thermal expansion of the bonded slices, has a negative influence on the precise control of the interelectrode spacing that is essential to the sensitivity of accelerometers. In this work, we propose the theory, simulation and experiment of a method that can alleviate both the stress and the warpage by applying different bonding temperature on the bonded slices. A quasi‐zero warpage is achieved experimentally, proving the feasibility of the method. As a benefit of the flat surface, the spacing of the capacitive displacement transducer can be precisely controlled, improving the self‐noise of the accelerometer to 6 ng/√Hz @0.07 Hz, which is about two times lower than that of the accelerometer using a uniform‐temperature bonding process.